Yudo Features Diffusion-Bonded Process for Hot Runner Manifolds
Appears in Print as: 'Diffusion-Bonded Hot Runner Manifold Improves Melt Distribution'
Yudo Inc. will be showcasing its diffusion-bonding process, which facilitates more design freedom for melt flow distribution, at Amerimold 2021.
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Photo Credit: Yudo Inc.
Diffusion bonding, Yudo’s solid-state diffusion welding process for hot runner manifolds, is meant to create hot runner systems in various volumetric sizes and cavity pitches with inherent advantages for melt distribution (see “How to Improve Melt Distribution with Diffusion-Bonded Manifolds”).
Diffusion bonding is usually implemented by applying high pressure, in conjunction with high temperature—approximately 50-75% of the absolute melting temperature of the materials. This causes the atoms from each material to combine with one another, resulting in a bond that is said to be stronger than weld.
The process reportedly eliminates sharp corners and dead spots within a manifold’s internal flow channels for optimized resin flow, and helps reduce color change over time. Yudo says it also uses this process for plastic injection molding components; cooling lines are placed in areas traditional machining cannot reach.
Exhibitor: Yudo Inc.
Booth 341
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